About Us
Company Introduction
We have established a complete closed-loop production system—spanning everything from wafer grinding and dicing to chip packaging and testing, and finally to SSD manufacturing and quality assurance—thereby building robust vertical integration capabilities. With a modern manufacturing facility covering over 10,000 square meters and eight SMT production lines, we boast a monthly production capacity of 800,000 units.
Through deep-seated collaboration with upstream and downstream industry partners, we continuously strengthen our technological independence and supply chain advantages. By leveraging integrated operations to drive product innovation and quality enhancements, we are steadily advancing toward a leading position within the industry.

Core Strengths
Full-Chain Vertical Integration and Autonomous Control Capabilities

The Ultimate Dual Advantage in Cost and Quality

Robust Market Resilience and Responsiveness to Demand

Sustained Leadership Driven by the Dual Engines of Technology and Capital

Corporate Environment
Corporate Culture
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Management and Talent -
Corporate Culture -
At Minder, we firmly believe -
Vision and Perspective -
Quality and Brand
Management and Talent
We implement an efficient, transparent, and flat management structure, advocating for fair competition and a merit-based system where the fittest prevail. We treat everyone equally yet never apply a one-size-fits-all approach; we tolerate experimentation and learning from mistakes, but we never condone complacency or slackness. Our unwavering commitment is to provide a platform where dedicated strivers can fully realize and demonstrate their true value.
Corporate Culture
The ultimate is the rule, transcendence is the ambition
At Minder, we firmly believe
Only through the pursuit of the absolute can we transcend. This is both our commitment to product quality and our stance in the face of competition.
Vision and Perspective
We monitor the industry with a global mindset—strategically visionary, yet tactically precise and pragmatic.
Quality and Brand
We regard quality as our cornerstone and our brand as a promise, weaving the pursuit of excellence into every detail of our R&D, production, and service.
Development History
2016
2017
2018
2019
2020
2021
2022
2023
2024
Successfully developed fully automated BGA RDT low-power testing equipment (a disruptive industry innovation).
Successfully secured direct supply channels from Samsung and SK Hynix (a core strategic asset); poised for launch, we are fully committed to incubating our brand.
2025
Invested in the subsidiary Chuxinwei Grinding Facility (primarily focused on the grinding and dicing of NAND Flash and controller wafers; capable of supporting 8-die stacking).
Successfully developed a low-cost BGA packaging process technology (a disruptive innovation within the industry).
Initiated the development of next-generation AI storage products (AISSD—a leading-edge offering in the industry).
The Taimi brand officially launched, establishing a global market presence.
2026


Corporate Honors






































































